RT/duroid 5880LZ laminates contain a unique filler that results in a low density, lightweight material for high performance and weight sensitive applications.

Features

  • Dk of 2.00 +/- .04
  • Low dissipation factor ranging from .0021 to .0027 at 10GHz
  • Low Z-axis coefficient of thermal expansion at 40 ppm/°C
  • Low density of 1.4 gm/cm3

Benefits

  • Lightweight / low density
  • Uniform electrical properties over a wide frequency range
  • Resistant to all solvents and reagents, hot or cold, normally used in etching or plating

Please see below for a sampling of data for this material formulation. For detailed material information and to use advanced features such as filtering, visit the Laminate Properties Tool.

RT/duroid® 5880LZ
Dielectric Constant, @10GHZ (2.5 GHz) Typical (Process) 2.00 +/- 0.04
Dielectric Constant, @10GHZ (2.5 GHz) Typical (Design) 2.0
Dissipation Factor TAN @10 GHz (2.5 GHz) (Typical) 0.0021
Thermal Coefficient εr -50°C to 150°C ppm/°C (Typical) 20
Volume Resistivity Mohm (Typical) 1.74x107
Surface Resistivity Mohm (Typical) 2.08x106
Water Absorption D48/50% (Typical) 0.31
Thermal Conductivity W/m/°K (Typical) 50°C ASTM D5470 0.33
Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) X 54
Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) Y 47
Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) Z 40
Peel Strength 1 oz (35um) ED Foil lbs/in. (N/mm) (Typical) >4.0
Density gm/cm3 (Typical) 1.4
Flammability Rating UL94 V-0
Lead-Free Process Compatible Y
PIM dBc Typical

Downloads

Description Language File Type File Size
Data Sheet
RT/duroid® 5880LZ High Frequency Laminates English
363KB
RT/duroid® 5880LZ 数据资料表 中文
622KB
Fabrication Information
Fabrication Guidelines RT/duroid 5880LZ High Frequency Laminates English
339KB
Quick Reference Processing Guidelines RT-duroid 5880LZ High Frequency Laminates English
55KB
How to Avoid Creep on Board Assemblies English
90KB
After Etch Stress Relief in RT/duroid Microwave Laminates English
76KB
Safety Notes on Using PTFE Composite Material English
63KB
Electrical Design Data
Line Widths for Various Characteristic Impedances of Centered Stripline Devices in a Variety of RT/duroid High Frequency Laminates English
86KB
Temperature Rise Estimations in Rogers High Frequency Circuit Boards Carrying Direct or RF Current English
80KB
Design Equations for Broadside and Edgewise Stripline English
147KB
Properties - Detailed Characteristics
A Study of Solder Temperature Effect of Copper Foil Adhesion to RT/duroid 5870 Material English
73KB
Copper Foils for High Frequency Circuit Materials English
908KB
RT/duroid PTFE-Based Composite Meets Flammability Requirements for Oxygen Environments English
44KB
Good Performance of RT/duroid Microwave Laminate in a Cryogenic Stripline Application at NASA English
52KB
Low Outgassing Characteristics of Rogers Laminates Approved for Spacecraft Applications English
101KB
The Effect of Exposure of RT/duroid PTFE-Based Composites to Nuclear Radiation English
68KB
高频电路材料之铜箔概述 中文
894KB
(M)SDS/PSIS
RT/duroid 5880 LZ - PSIS English
33KB

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