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Home >> Advanced Connectivity Solutions >> Products >> Bondply/Prepreg
Thermoset and thermoplastic high performance bonding layers for multilayer board construction using Rogers high frequency and high speed digital materials.
2929 Bondply is an unreinforced hydrocarbon based thin film adhesive system intended for use in high performance, high reliability multi-layer constructions.
Rogers 3001 bonding film is a thermoplastic chloro-fluorocopolymer and is recommended for bonding low dielectric constant PTFE (Polytetrafluoroethylene) microwave stripline packages and other multilayer circuits.
chloro-trifluoroethylene (CTFE) thermoplastic copolymer.
ULTRALAM® 3908 bondply is used as a bonding medium (adhesive layer) between copper and the dielectric material.