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Home >> Advanced Connectivity Solutions >> Products >> ULTRALAM® 3000 Flexible Copper Clad Laminate and Bondply
The dielectric material used in ULTRALAM® 3850HT laminates has a melt temperature of 330C which can simplify the process of building multilayer boards and lead to increased yields. ULTRALAM 3850HT circuit materials from Rogers Corporation, utilize highly temperature resistant liquid crystalline polymer (LCP) as the dielectric film. These products were developed specifically for single layer and multilayer substrate constructions.
These adhesiveless laminates are well suited for high speed and high frequency applications used in mobile internet devices (phones/tablets), automotive radar, and moisture sensitive MMIC and chip packaging applications.
ULTRALAM 3850HT circuit materials are characterized by thin cores with low and stable dielectric constant and dielectric and copper loss, which are key requirements for high frequency, high-speed products. ULTRALAM 3850HT is offered as a double copper clad laminate offered in panels. It can be used for multilayer constructions with ULTRALAM 3908 bonding film.
ULTRALAM® 3850HT laminate circuit materials utilize highly temperature resistant liquid crystalline polymer (LCP) as the dielectric film. Developed specifically for single layer and multilayer substrate constructions, these adhesiveless laminates are well suited for high speed and high frequency applications.
ULTRALAM® 3908 bondply is used as a bonding medium (adhesive layer) between copper and the dielectric material.