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PORON® ShockPad Foam

Now available as thin as 0.1MM

The newest smartphones, tablets and other mobile internet devices (MID) are as slim as ever, and designers are being asked to fit even more features and gadgets into these tiny packages. As part of space-saving designs, the display, the printed wiring board, and other electrical components are compacted into very thin spaces. Unfortunately, these components often lack proper impact protection technology. How can Rogers help?

PORON ShockPad Foam has always been a reliable impact solution when used behind gasketless MID displays, in front of printed wiring boards (PWB) and alongside other internal components. Now, with an even thinner profile, ShockPad is more versatile than ever.

Key Benefits & Features

Provides up to 7 times greater impact protection
Excellent compression-set resistance
Ease of processing to eliminate production delays

Smartphone Impact Testing

The images below were compiled using the following test conditions:

Impacting Object: 30.8 g brass ball
Height of Drop: 0.3 meters
Display Module: 0.5 mm glass on both sides of foam
Material Demonstration: 0.3mm Foam