Olivier‘s Twist blog, published monthly, is contributed to by Olivier Mathieu and other experts from Rogers Corporation’s Power Electronics Solutions, providing technical advice and information about advanced materials technologies that significantly increase efficiency, manage heat and ensure the quality and reliability in power electronics.
  • Applications for Metallized Ceramic Substrates
    Reliability | Oct 19, 2020

    Among other measures, voltage, current and mission profile are critical parameters to consider in the selection of the substrate for a given application. In this blog, we look at common applications for multi-chip power modules to understand the rationale behind each technology.

  • High Performance Busbars for e-Mobility
    Reliability | Sep 09, 2020

    The motor, battery and electrical control system are known as the tri-electric system of e-Mobility.

  • Determining the Thermal Conductivity of Thin Ceramics
    Thermal Management | Jul 28, 2020

    During the design phase of a power module, engineers select the components, materials and manufacturing technologies to fulfill the requirements regarding performance, reliability and costs set by their customers. Over-engineering can be desirable when safety, reliability and performance are critical.

  • Frequently Asked Power Electronics Questions
    Reliability | Jul 01, 2020

    In this edition we would like to answer a few frequently asked questions to benefit those new to the power electronics community and a refresher training for those experienced in the industry as well.

  • Optimal Interconnection for Prismatic Battery Systems in Electric Vehicles
    Thermal Management | Jun 16, 2020

    In a previous blog, we examined the current collector busbars for the cylindrical cell in electric vehicles. Many of the electrical, mechanical and thermal requirements are also applicable to prismatic cells. However, the manner in which a battery pack in the vehicle is designed depends on the OEM´s preference.

  • Thank You for Your Orders!
    Reliability | May 01, 2020

    During this time of uncertainty due to the coronavirus pandemic, we greatly appreciate the strong relationships that have been built over the last decades. We are focused and working hard to ensure that we continue to serve you through this evolving situation.

  • Influence of Copper Grain Size on Assembly Process and Substrate Performance
    Thermal Management | Apr 06, 2020

    The copper grain size is an important property of Direct Bonded Copper (DBC) substrates. Variations in the copper grain size cannot be fully excluded, but large variations may affect the subsequent assembly processes or the performance of DBC substrates. Module manufacturers can rely on the experience and competence of Rogers' Power Electronics Solutions team to deliver substrates with a consistent grain size.

  • Optimal Interconnection for Cylindrical Battery Systems in Electric Vehicles
    Reliability | Mar 04, 2020

    Thermal management is a challenge that the correct busbar can assist with, especially for cylindrical cell connections where the busbar may connect hundreds of cells to make a complete module.

  • Metallized Ceramic Substrates for the New Decade
    Reliability | Jan 27, 2020

    Direct Bonded Copper (DBC) and Active Metal Brazed (AMB) substrates have been available for the last four decades. Together they have made a large contribution to the market adoption and penetration of power modules.

  • Considerations for the Design of DBC and AMB Substrates
    Reliability | Jan 09, 2020

    The beginning of a new year is a time for resolutions. It is also a perfect opportunity to discuss key principles to design custom Direct Bonded Copper (DBC) and Active Metal Brazed (AMB) substrates.

  • ROLINX CapLink Solutions: 1+1 > 2: Low inductance integrated capacitor and DC link busbar solution for e-Mobility
    Reliability | Dec 09, 2019

    Information on ROLINX CapLink solutions: a complete integration of a laminated busbar and discrete film capacitor.

  • Insulation Materials for Laminated Busbars - A discussion on flexible and rigid insulation films and their parameters (Interview with Sebastiaan De Boodt)
    Reliability | Nov 01, 2019

    In today's blog you will find an interview with Sebastiaan De Boodt, who works for Rogers Corporation.

  • curamik® Micro Channel Coolers
    Reliability | Oct 01, 2019

    Olivier Mathieu talks about the design, internal structure and thermal performance of our micro channel liquid coolers.

  • Back to the Pages of History
    Reliability | Sep 04, 2019

    In the last decade power electronics has gained importance with climate targets set to cut greenhouse gas emissions; therefore increasing renewable energy consumption. The new generation is aware of the environment and pollution challenges that our society is facing, motivating and attracting young engineers to study power electronics.

  • Copper Is Here to Stay in Power Electronics
    Reliability | Aug 01, 2019

    While silicon is the most common element used for power semiconductors, copper is the most popular choice for conductor traces on printed circuit boards (PCBs) and ceramic substrates due to its electrical conductivity.

  • Simulations That Help You
    Reliability | Jun 24, 2019

    Electronic systems rely on efficient combination and distribution of voltages and currents from different sources. In high-power applications, such as industrial drives, renewable energy inverters, powertrains for electric vehicles and converters used in rail, energy must be channeled with minimal power losses.

  • How does Gallium Nitride fit into the Next Generation of High Performance Electronics
    Thermal Management | May 25, 2019

    In a recent Olivier’s Twist blog, the topic of Silicon Carbide semiconductor materials was discussed for future high power efficiency applications. There is also another semiconductor technology that is filling a gap in performance between Silicon and Silicon Carbide, and that is Gallium Nitride.

  • Inductance, Partial Discharge and Other Critical Performances in Laminated Busbars
    Reliability | Apr 29, 2019

    Dominik Pawlik explains the details about laminated busbars, the advantages and where the busbars are used.

  • There is a Packaging Problem to Solve for Silicon Carbide Devices
    Thermal Management | Mar 27, 2019

    There is currently a lot of interest for silicon carbide (SiC) as a semiconductor material because its properties make it more promising than silicon for power electronics applications.

  • Learn All About Laminated Busbars
    Reliability | Feb 28, 2019

    A Quick Introduction to ROLINX® Laminated Busbar Solutions, Dominik Pawlik explains the details about laminated busbars, the advantages and where the busbars are used.

  • CES 2019: A Look at the Technology in Your Near Future
    Reliability | Feb 01, 2019

    Josh Goldberg takes you to the floor of the 2019 Consumer Electronics Show in Las Vegas to take a closer look at some of the technologies that will soon be entering our lives.

  • Are you flattering me?
    Reliability | Aug 31, 2018

    Who cares about flatness? Process and application engineers do! These are not flattering words as they truly know how critical it is to understand and control the shape of one’s substrate, base plate and heat sink in order to achieve the best possible production yield and module performance. In this blog, I want to share with you some information about flatness that you may wish to consider as you design or use power modules.

  • Building Power Modules is not Magic but Requires High Quality Substrates
    Reliability | Jul 31, 2018

    Design engineers are selecting Direct Bonded Copper (DBC) and Active Metal Brazed (AMB) substrates as circuit material for bare semiconductor chips in their power modules as they efficiently dissipate the waste heat from the semiconductors and increase the lifetime of the modules. In this blog, we explain the production process for power modules and highlight the most important characteristics of the substrates at each step of this assembly process.


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