Rogers 2929 bondply is an unreinforced, thermoset based thin film adhesive system.
92ML™ Materials are halogen-free, flame retardant, ceramic-filled thermally conductive multifunctional epoxy prepreg and laminate systems.
Rogers AD Series PTFE or woven glass based laminates are designed for use in high frequency PCB materials.
Rogers Corporation’s CLTE Series® products are PTFE, woven-glass, microdispersed ceramic composite laminates with low CTE values ideal for high reliability.
COOLSPAN® Thermally and Electrically Conductive Adhesive (TECA) is a thermosetting, epoxy based, silver filled adhesive film used in bonding high power circuit boards.
Rogers Corporation’s CuClad® laminates are woven fiberglass reinforced PTFE based composites for use as PCB substrates and radomes in high frequency applications.
Rogers Corporation’s DiClad® laminates are fiberglass reinforced PTFE based composites for use as printed circuit board substrates in high frequency applications.
Rogers Corporation’s IM Series™ laminates extend the capabilities of the successful AD300D™, AD255C™ and DiClad® 880 product grades.
IsoClad® laminates are non-woven fiberglass reinforced PTFE based composites for use as printed circuit board substrates.
Kappa® 438 thermoset laminates are glass reinforced hydrocarbon materials, developed for wireless circuit designers looking for a better performing and more reliable alternative to FR-4 laminates.
MAGTREX™ 555 high impedance laminates are the first commercially available low loss laminate with controlled permeability and permittivity.
Rogers offers a wide arrangement of bonding and adhesion materials directly matched to complement our broad, industry-leading, high frequency circuit material offerings.
RO3000® high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications.
RO4000® hydrocarbon ceramic laminates and prepregs are the industry leader.
RT/duroid® high frequency circuit materials are filled PTFE (random glass or ceramic) composite laminates for use in high reliability, aerospace and defense applications.
SpeedWave™ 300P prepreg is a low dielectric constant, ultra-low loss resin material system that can be used to bond a variety of Rogers’ laminates
Rogers Corporation’s TC Series® laminates are PTFE, woven fiberglass and high thermal conductivity ceramic filled materials that provide improved PBC thermal management for applications requiring high power RF signals.
Rogers TMM® thermoset microwave laminates combine low thermal coefficient of dielectric constant, a copper matched coefficient of thermal expansion and dielectric constant uniformity.
Rogers Corporation’s XtremeSpeed™ RO1200™ laminates and bondplys are low dielectric constant, low loss materials engineered to meet the unique electrical, thermal and mechanical requirements of high speed designs.
Rogers partners with customers in a wide range of industries, providing advanced materials to power, protect and connect our world.
Explore current uses of the products in the Advanced Connectivity Solutions Business Unit.