Product Lines

2929 Bondply Series

Rogers 2929 bondply is an unreinforced, thermoset based thin film adhesive system.

92ML™ Materials

92ML™ Materials are halogen-free, flame retardant, ceramic-filled thermally conductive multifunctional epoxy prepreg and laminate systems.

AD Series® Laminates

Rogers AD Series PTFE or woven glass based laminates are designed for use in high frequency PCB materials.

CLTE Series® Laminates

Rogers Corporation’s CLTE Series® products are PTFE, woven-glass, microdispersed ceramic composite laminates with low CTE values ideal for high reliability.


COOLSPAN® Thermally and Electrically Conductive Adhesive (TECA) is a thermosetting, epoxy based, silver filled adhesive film used in bonding high power circuit boards.

CuClad® Series

Rogers Corporation’s CuClad® laminates are woven fiberglass reinforced PTFE based composites for use as PCB substrates and radomes in high frequency applications.

DiClad® Series Laminates

Rogers Corporation’s DiClad® laminates are fiberglass reinforced PTFE based composites for use as printed circuit board substrates in high frequency applications.

IM Series™ Laminates

Rogers Corporation’s IM Series™ laminates extend the capabilities of the successful AD300D™, AD255C™ and DiClad® 880 product grades.

IsoClad® Series Laminates

IsoClad® laminates are non-woven fiberglass reinforced PTFE based composites for use as printed circuit board substrates.

Kappa® 438 Laminates

Kappa® 438 thermoset laminates are glass reinforced hydrocarbon materials, developed for wireless circuit designers looking for a better performing and more reliable alternative to FR-4 laminates.

MAGTREX™ Laminates

MAGTREX™ 555 high impedance laminates are the first commercially available low loss laminate with controlled permeability and permittivity.

Prepregs and Bondplys

Rogers offers a wide arrangement of bonding and adhesion materials directly matched to complement our broad, industry-leading, high frequency circuit material offerings.

RO3000® Series

RO3000® high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications.

RO4000® Series

RO4000® hydrocarbon ceramic laminates and prepregs are the industry leader.

RT/duroid® Laminates

RT/duroid® high frequency circuit materials are filled PTFE (random glass or ceramic) composite laminates for use in high reliability, aerospace and defense applications.

SpeedWave™ 300P Prepreg

SpeedWave™ 300P prepreg is a low dielectric constant, ultra-low loss resin material system that can be used to bond a variety of Rogers’ laminates

TC Series® Laminates

Rogers Corporation’s TC Series® laminates are PTFE, woven fiberglass and high thermal conductivity ceramic filled materials that provide improved PBC thermal management for applications requiring high power RF signals.

TMM® Laminates

Rogers TMM® thermoset microwave laminates combine low thermal coefficient of dielectric constant, a copper matched coefficient of thermal expansion and dielectric constant uniformity.

XtremeSpeed™ RO1200™ Series 

Rogers Corporation’s XtremeSpeed™ RO1200™ laminates and bondplys are low dielectric constant, low loss materials engineered to meet the unique electrical, thermal and mechanical requirements of high speed designs.


Which Material Properties Have the Most Impact in High Speed Digital Applications
John Coonrod, Rogers Corporation

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US and Canada: ACS exclusively distributes our products in the US and Canada through International Electronic Components (IEC).

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Europe: ACS exclusively distributes our products in the European Community (except Spain and Italy) through CCI Eurolam (CCI).

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ROG Blog

The Rog Blog is contributed by John Coonrod and various other experts from Rogers Corporation, providing technical advice and information about RF/microwave materials.

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DesignCon 2021 - San Jose, CA USA

August 17, 2021 - August 18, 2021


PCB West - Santa Clara Convention Center, CA

October 06, 2021 - October 06, 2021

TechConnect World Innovation Conference & Expo - Washington, DC

October 18, 2021 - October 20, 2021

Booth #614