CLTE laminates have proven excellent dimensional stability and low planar CTE, providing consistent performance for embedded resistors: among the lowest variance available for PTFE-based laminates. CLTE laminates have a long history of use with Resistor Foil and are available with a full range of other cladding types (including electrodeposited, reverse treated copper, rolled copper foil or more). CLTE laminates’ tried and tested performance continues to make them a top choice for a wide range of ground-based and airborne communications and radar systems.

Features

  • Low thermal expansion in X, Y and Z of 10, 12 and 34 ppm/°C
  • Dielectric constant stability with temperature change
  • Available as a reliable and consistent thin laminate (.0003”)
  • Available with heavy metal backing (aluminum, brass and copper)

Benefits

  • High plated through hole reliability
  • Reduced stress attachment to ceramic active devices
  • Supports complex multi-layer boards
  • Reliably designed with embedded resistor networks

Downloads

Description Language File Type File Size
Fabrication Information
Quick Reference Processing Guidelines CLTE Series Laminates English
43KB
Fabrication Guidelines CLTE Series Laminates English
279KB
CLTE系列高频材料加工指南 中文
2MB
CLTE系列高频材料加工指南快速参照表 中文
457KB
(M)SDS/PSIS
CLTE Series Laminates - PSIS English
32KB

Tools

Explore our calculators, conversion tools, technical papers and more.

Need a Sample?

Samples can be requested through our online request system.

Sample Requests

Support

Advanced Connectivity Solutions

Find local representatives for personalized support.