CuClad 250 laminates use a higher fiberglass/PTFE ratio to provide mechanical properties approaching those of conventional substrates. These laminates provide better dimensional stability and lower thermal expansion in all directions.


  • Dielectric constants (Dk) ranging from 2.40 to 2.60 (in .05 increments)
  • Dissipation factor of .0018 at 10 GHz
  • Low moisture absorption and out-gassing
  • Stable Dk over a wide frequency range


  • Cross-plied construction provides balanced electrical and mechanical properties
  • Low Dk supports wider line widths for lower insertion loss
  • Low circuit losses at high frequency
  • Available in LX testing grade with test report for critical applications


Description Language File Type File Size
Data Sheet
CuClad® Laminates Data Sheet English
CuClad Series Laminates - PSIS English


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