Benefits

  • Compatible with FR-4 fabrication processes
  • Well controlled dielectric constants (Dk)
  • Above-average thermal conductivity (.6-.8)
  • Thermally robust - lead free soldering compatibility
  • Low Z-axis CTE for reliable plated through-hole quality
  • Optimized cost and RF/ microwave performance
  • Wide range of DK available (2.55-6.15)
  • UL 94 V-0 flame retardant versions available

Products

RO4000® LoPro® Laminates

  • Allows reverse treated foil to bond to standard RO4000® dielectric
  • Low DK loss for higher operating frequency designs
  • Reduced passive intermodulation (PIM) performance

RO4003C™ Laminates

  • Original RO4000® material, used in cost sensitive Microwave/RF designs
  • Dk of 3.38 (+/-0.05)
  • Dissipating factor of 0.0027 at 10 GHz is lowest dielectric loss of R04000® product family

RO4350B™ Laminates

  • Market leading material for base station power amplifier designs
  • UL 94 V-0 rated
  • Dk of 3.48 (+/-0.05)
  • Df 0.0037 at 10 GHz

RO4360G2™ Laminates

  • RoHS certified
  • Low Z-axis CTE
  • Dk 6.15 (+/- 0.015)
  • Dissipating factor of 0.0038 at 10 GHz

RO4400™ Series Bondply

  • Prepreg family based on RO4000 series core materials.
  • Sequential lamination capable
  • Lead free soldering capable

RO4500™ Laminates

  • Commercial antenna grade series for high volume designs
  • Excellent mechanical rigidity for efficient and reliable installation
  • Improved PIM when used with LoPro™ copper

RO4700™ Antenna Grade Laminates

  • First RO4000® low Dk antenna grade material available
  • Dk 2.55 (+/- 0.05) or 3.0 (+/- 0.05)
  • Df 0.00222 at 2.5 GHz or 0.0023 at 2.5 GHz, respectively

RO4830™ Laminates

  • Low cost solution for millimeter wave patch antenna designs
  • Insertion loss similar to RO3003™ laminate with standard ED copper at 77GHz
  • Spread glass to minimize Dk variation

RO4835™ Laminates

  • 10x oxidation resistance compared to traditional thermoset laminates
  • Dk 3.48(+/-0.05)
  • Df 0.0037 at 10GHz

RO4835T™ Laminates

  • Thin offerings of the RO4835™ Laminates
  • Spread glass minimizes Dk variation

CU4000™ and CU4000 LoPro® Foil

  • IPC-4562A Grade 3, High Temperature Elongation Foil
  • Enables foil lamination of RO4000 Multilayer PCB
  • Simplifies Multilayer PCB registration

Tools

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