RO4000 dielectric materials have long been used in combination with FR-4 cores and prepreg as a means to achieve a performance upgrade of standard FR-4 multi-layer designs. RO4003C™, RO4350B™ and RO4000 LoPro® glass reinforced hydrocarbon/ceramic laminates have been used in layers where RF / microwave frequency, dielectric constant (Dk), or high-speed signal requirements dictate high performance materials. FR-4 cores and prepreg are still commonly used to inexpensively form less critical signal layers.
|Description||Language||File Type||File Size|
|RO4400™ Series Bondply Data Sheet - RO4450F™ RO4450T™ and RO4460G2™ Bondply||English||
|RO4450T™ Bondply Data Sheet||English||
|Fabrication Guidelines RO4835T Core-RO4450T Bonding Layers Multi-layer Board Procesing Guidelines||English||
|Fabrication Guidelines RO4400 Bonding Layers||English||