TC350 Plus materials offer the designer a unique combination of lower loss tangent (and insertion loss) and high thermally conductive fillers to enable superior reliability and reduced operating temperatures in high power applications.

Features

  • Dielectric constant (Dk) of 3.5
  • High thermal conductivity of 1.24 W/m-K
  • Low thermal coefficient of Dk at -42 ppm/°C, -40°C to 140°C
  • Low loss tangent of .0017 at 10 GHz
  • Low Z-axis coefficient of thermal expansion (CTE) at 38 ppm/°C

Benefits

  • Reduced junction temperature and improved reliability
  • Reduced heat generated through transmission line loss
  • Improved bandwidth utilization and efficiency for amplifiers and antennas
  • High plated through hole reliability
  • CTE matches active components for low stress solder joints

Downloads

Description Language File Type File Size
Data Sheet
TC350™ Plus Data Sheet English
121KB
TC350™ Plus 层压板数据资料表 中文
488KB
Fabrication Information
Fabrication Guidelines TC350-TC600 Laminates English
226KB
TC Series高频线路板板材加工指南 中文
757KB
(M)SDS/PSIS
PSIS - TC Series Laminates English
33KB
SDS - TC Series Laminates Deutsch
36KB

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