AD255C laminates combine the superior thermal properties of a fluoropolymer resin system with selected ceramic materials and fiberglass reinforcement to yield a RF laminate material with lower loss, lower thermal expansion properties and lower passive intermodulation (PIM). Stability of PTFE over wide frequency and temperature ranges, with low loss properties, makes AD255C laminates ideal for a variety of microwave and RF applications in telecommunication infrastructure.

Features

  • Very low loss PTFE and ceramic filled composite
  • .0014 loss tangent at 10GHz and base station frequencies
  • Dielectric constant of 2.55 with tight tolerance
  • Low profile copper
  • Low Z-direction CTE (50 ppm/°C)
  • Larger panel sizes available

Benefits

  • Lower insertion loss
  • Low PIM for antenna applications
  • Phase stability due to excellent TCEr
  • Compatible with the processing used for standard PTFE based PCB substrates

Downloads

Description Language File Type File Size
Data Sheet
AD Series Data Sheet - AD250C - AD255C - AD260A - AD300D - AD320A - AD350A English
80KB
AD Series™ 天线级层压板数据资料表 中文
522KB
Fabrication Information
Fabrication Guidelines AD Series Laminates AD250C AD255C AD260C AD300C AD300D AD320A AD35 English
65KB
Properties - Detailed Characteristics
AD Series™ Laminates Supplemental White Paper English
57KB
Technical Information
PIM and PCB Antennas Guide English
3MB
PIM及PCB天线-低PIM天线电路材料指南 中文
1MB
(M)SDS/PSIS
AD Series Laminates - PSIS English
33KB

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