TC350 materials offer designers a unique combination of low insertion loss and higher thermal conductivity. This enables superior reliability and reduced operating temperatures in high power applications.

Features

  • Dielectric constant (Dk) of 3.5
  • High thermal conductivity of 1.0 W/m-K
  • Low thermal coefficient of Dk at-9 ppm/°C, -40°C to 140°C
  • Low loss tangent of .002 at 10GHz
  • Low coefficient of thermal expansion on X, Y and Z axis (7, 7, and 23ppm/°C respectively)

Benefits

  • Reduced junction temperature and improved reliability
  • Excellent heat dissipation and management
  • Improved bandwidth utilization and efficiency for amplifiers and antennas
  • Unsurpassed plated through hole reliability

Downloads

Description Language File Type File Size
Data Sheet
TC350™ Laminates Data Sheet English
322KB
Fabrication Information
Fabrication Guidelines TC350-TC600 Laminates English
226KB
(M)SDS/PSIS
PSIS - TC Series Laminates English
33KB
SDS - TC Series Laminates Deutsch
36KB

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