TMM 6 laminates offer a combination of the benefits of both ceramic and traditional PTFE microwave circuit laminates without requiring the specialized production techniques common to those materials, all at a unique dielectric constant (Dk) compared to other materials in the product family.

Features

  • Dk of 6.0 +/- .080
  • Dissipation factor of .0023 at 10GHz
  • Thermal coefficient of Dk of -11 ppm/°K
  • Coefficient of thermal expansion matched to copper
  • Available in a thickness range of .0015 to .500 inches +/- .0015”

Benefits

  • Mechanical properties resist creep and cold flow
  • Resistant to process chemicals, reducing damage during fabrication
  • Based on a thermoset resin, allowing for reliable wire-bonding
  • All common PWB processes can be used with TMM 6 materials

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