Rogers Corporation is a proud leader in thermal solutions that protect electronics and critical systems. The heat generated from electronic devices, systems and circuits require thermal management to maintain prime operating conditions and avoid premature component failure, performance throttling or user discomfort. Rogers Corporation provides solutions to fit every design need by means of heat-storage, heat-conduction and cooling materials. In addition to their sealing, gasketing and cushioning, Rogers Corporation silicones provide thermal insulation capabilities by reducing the transfer of heat between objects.
HeatSORB™ phase change material consistently absorbs large amounts of heat in product designs with thermal cycling, avoiding temperature spikes and allowing devices to remain cooler for longer. HeatSORB accomplishes this by leveraging an immobilized compound that requires a large amount of enthalpy to transition from one physical state to another, providing long-lasting and reliable thermal management.
Rogers manufactures several heat conducting thermal management solutions, providing the necessary transfer of heat through solids to maintain optimal operating temperatures.
curamik® ceramic substrates provide high heat spreading, very high isolation voltage and enable chip-on-board production. These substrates use direct bond copper (DBC) technology to join conductors with alumina, aluminum nitride (AlN) or Silicon Nitride (Si3N4) to form high power circuitry.
ML Series™ laminates and prepregs are thermally conductive and spread heat away from components to reduce hot spots. These laminates are used in both single printed circuit boards (PCB) and multilayer PCBs.
TC Series™ laminates provide high power RF signal applications improved thermal management with high thermally conductive ceramic fillers and woven glass reinforcement.
COOLSPAN® Thermally and Electrically Conductive Adhesive (TECA) is used to bond circuit boards to other materials and provide both thermally and electrically conductive properties.
The Secure® thermal transfer adhesive is a thermally conductive silicone polymer and adhesive material that provides electrical isolation in gaps while providing maximum heat removal.
curamik® cooling solutions are hermetically sealed micro or macro channel liquid coolers that combine copper and ceramic DBC substrates with specific channels to provide well controlled thermal resistance, pressure drop and flow rate, ideal for high power applications.
curamik® CoolEasy is a high precise machined copper cooler that provides a passive liquid cooling thermal management solution often used for laser diode applications.