Condux Plus foam is an electrically conductive foam that offers excellent and consistent conductivity across a wide range of compression levels. The primary application of this material is its use as grounding pags. Condux Plus foam avoids and prevents undesirable electromagnetic fields by connecting two conductive materials that have different electric potentials within handheld devices. Condux Plus materials retain their thickness under temperature and load to provide a consistent and reliable electrical connection. Condux Plus materials have also been shown to shield electrical devices from a wide range of EM frequencies. For reliable electrical grounding and shielding, Condux Plus is the optimal solution for high quality mobile devices.

Features

  • Available in two thicknesses of .33 or .53 mm
  • Compression force deflection (CFD) of 14 or 21kPa, respectively
  • Provide EMI shielding effectiveness of 50 dB, from 300MHz to 10GHz

Benefits

  • High material integrity – holds shape and does not collapse during die cutting
  • Highly conductive with consistent connectivity
  • Reliable grounding and shielding

Downloads

Description Language File Type File Size
Sell Sheet
Condux Plus Electrically Conductive Foam English
496KB
Condux Plus™导电泡沫 中文
778KB
Technical Information
Shelf-Life and Proper Storage of PORON Polyurethane Materials English
115KB
Product Information
PORON® Polyurethanes Product Availability Brochure English
484KB
(M)SDS/PSIS
PSIS - Condux Plus™ English
129KB
PSIS - Condux Plus™ EC-2040-2130 English
41KB

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