TC350™ Laminates

TC350 materials offer designers a unique combination of low insertion loss and higher thermal conductivity. This enables superior reliability and reduced operating temperatures in high power applications.

Features

• Dielectric constant (Dk) of 3.5
• High thermal conductivity of 0.72 W/m-K
• Low thermal coefficient of Dk at-9 ppm/°C, -40°C to 140°C
• Low loss tangent of .002 at 10GHz
• Low coefficient of thermal expansion on X, Y and Z axis (7, 7, and 23ppm/°C respectively)

Benefits

• Reduced junction temperature and improved reliability
• Excellent heat dissipation and management
• Improved bandwidth utilization and efficiency for amplifiers and antennas
• Unsurpassed plated through hole reliability

Applications

View current applications of this product.

Backhaul Radios

Communications
Systems

Thermal Solutions

• Backhaul Radios
• Communications
  Systems
• Thermal Solutions