Published
by John Coonrod, Technical Marketing Manager
Advanced Electronics Solutions
As millimeter-wave technologies continue to advance in the printed circuit board (PCB) industry, there are emerging needs for more diverse circuit constructions. A previous limiting factor for complex millimeter-wave PCB constructions, had been appropriate bonding materials to accommodate the circuit fabrication as well as the demanding RF performance at these high frequencies. These issues have been addressed in the following blog.
Read the Full Article at Microwave Journal
Related Products:
2929 Bondply, RO4000 Series Laminates, SpeedWave 300P Prepreg
Tags:
Automotive & EV/HEV, ROG Blog
Published on May 07, 2021