High performance electronic products, such as motor drives and HEV powertrains, are driving the need for better battery pack interconnection and packaging solutions that can handle higher currents and voltages. For effective battery pack design, long-term reliability in harsh environmental conditions and resistance to damaging vibrations are essential. Rogers offers integrated ceramic substrates and busbar solutions to meet the challenges of evolving battery pack design.
Rogers’ curamik® Ceramic Substrates and ROLINX® busbars provide battery pack IGBT solutions by boosting performance, minimizing power losses and optimizing thermal management. A variety of packaging options are available for mechanical support, electrical interconnection, heat dissipation and protection from the external environment. Selection of the proper packaging materials depends on the electrical, thermal and mechanical properties of the resulting power device. New designs improve efficiency and reliability while reducing size, weight and power consumption.
Within the IGBT power module curamik® ceramic substrates provide interconnections and cool components.
ROLINX® laminated busbars provide a customized liaison between the power source and MOSFET module.