With a low dielectric constant (Dk) and dissipation factor, XtremeSpeed RO1200 materials provide outstanding signal integrity, reduced signal skew and reduced cross-talk. Combined with superior thermal/mechanical performance, low CTE and a halogen free UL 94 V-0 rating, XtremeSpeed RO1200 materials are well suited for the most demanding high layer count applications.


  • Low Dk
  • Max dissipation factor of .0017 (Laminate) and .0012 (Bondply) at 10GHz
  • Low CTE, Decomposition Temperature (Td) of 500°C TGA
  • Low profile rolled copper cladding on laminates
  • Spread glass reinforced laminates for improved rigidity and ease of handling
  • Unreinforced bondply enables best-in-class electrical performance
  • Halogen free


  • Outstanding signal integrity (SI)
  • Excellent thermal/mechanical performance characteristics
  • Lead-free process compatible
  • Reduced signal skew
  • Ideal for high layer count structures



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