curamik® Cooling Solutions

Rogers curamik Cooling Solutions offer a suite of advanced liquid cooling solutions powered by the state of the art curamik bonding process. curamik® cooling solutions, are setting the standard for liquid cooling in high-power applications. These innovative liquid coolers feature copper foil channel structures that are bonded into a tight block using the curamik process. We also offer the curamik® CoolEasy, a high precision machined copper cooler for passive laser diode cooling.

Benefits

Four times more efficient than traditional liquid cooling module structures
Uses the bonding strength of curamik
Weighs less than other liquid cooling options
Available in smaller sizes

Products

curamik® CoolEasy

High precise machined copper cooler
Capable of being diamond-milled for laser diode specifications
Used with high power laser diodes in the 20-80W range

curamik® CoolPerformance /
curamik® CoolPerformance Plus

High performance copper coolers for laser diode applications
Cool laser diode bars up to 5 mm cavity length
Can be used with high power laser diodes in the 20-100W range
curamik CoolPerformance Plus reduces the CTE value to 5-6.5 ppm/K

curamik® CoolPower /
curamik® CoolPower Plus

Copper liquid coolers for high power applications
Layers hermetically combined without any additional soldering or adhesive
curamik CoolPower Plus coolers are integrated Direct Bond Copper (DBC) with ceramic substrates, enabling direct component assembly and electrical isolation from the cooling circuit