For decades, design engineers have relied on Rogers’ advanced materials to enable commercial aircraft and aerospace and defense systems, even in the harshest conditions. Today, our high reliability, high performance solutions can be found in the majority of the world’s commercial and military aircraft. Look to Rogers for high frequency circuit materials for radar and navigation systems, ceramic substrates and laminated busbars that improve performance and dissipate heat, and gasketing solutions for extreme sealing and protection.
View current applications of Rogers' products, relating to the Aerospace & Defense market.
2929 Bondply Series
Rogers 2929 bondply is an unreinforced, thermoset based, thin film adhesive system.
AD Series® Laminates
Rogers AD Series PTFE or woven glass based laminates are designed for use in high frequency PCB materials.
Rogers ARLON® Silicone Technologies are the industry leaders in silicone elastomers.
The BISCO® product line is the world leader in silicone foams used for gasketing and sealing applications.
CLTE Series® Laminates
Rogers Corporation’s CLTE Series® products are PTFE, woven-glass, microdispersed ceramic composite laminates with low CTE values ideal for high reliability.
COOLSPAN® TECA Film
COOLSPAN® Thermally and Electrically Conductive Adhesive (TECA) is a thermosetting, epoxy based, silver filled adhesive film used in bonding high power circuit boards.
Rogers Corporation’s CuClad® laminates are woven fiberglass reinforced PTFE based composites for use as PCB substrates and radomes in high frequency applications.
curamik® Cooling Solutions
Rogers Corporation offers a suite of advanced liquid cooling solutions powered by the state of the art curamik® bonding process.
curamik® Metallized Ceramic Substrates
Rogers Corporation’s curamik® product suite offers best-in-class metallized ceramic substrates that lead the industry in enabling power electronic printed circuits.
The DeWAL® product line is the industry leading manufacturer of high-performance polymer films and pressure-sensitive PTFE and UHMW tape.
DiClad® Series Laminates
Rogers Corporation’s DiClad® laminates are fiberglass reinforced PTFE based composites for use as printed circuit board substrates in high frequency applications.
IM Series™ Laminates
Rogers Corporation’s IM Series™ laminates extend the capabilities of the successful AD300D™, AD255C™ and DiClad® 880 product grades.
IsoClad® Series Laminates
IsoClad® laminates are non-woven fiberglass reinforced PTFE based composites for use as printed circuit board substrates.
MAGTREX® 555 high impedance laminates are the first commercially available low loss laminate with controlled permeability and permittivity.
Radix™ Printable Dielectric
Radix Printable Dielectric material is the first UV-curable 3D printing resin designed for RF applications.
RO3000® high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications.
RO4000® hydrocarbon ceramic laminates and prepregs are the industry leader.
RT/duroid® high frequency circuit materials are filled PTFE (random glass or ceramic) composite laminates for use in high reliability, aerospace and defense applications.
SpeedWave® 300P Prepreg
SpeedWave® 300P prepreg is a low dielectric constant, ultra-low loss resin material system that can be used to bond a variety of Rogers’ laminates
TC Series® Laminates
Rogers Corporation’s TC Series® laminates are PTFE, woven fiberglass and high thermal conductivity ceramic filled materials that provide improved PBC thermal management for applications requiring high power RF signals.
Rogers TMM® thermoset microwave laminates combine low thermal coefficient of dielectric constant, a copper matched coefficient of thermal expansion and dielectric constant uniformity.