TMM® Laminates

TMM high frequency laminates are ideal for high reliability strip-line and micro-strip applications due to their electrical and mechanical stability. All dielectric variants can be produced as molded, 3-dimensional shapes. Shaped TMM components open up a new range of innovative design solutions for high or low frequency applications requiring controlled dielectric constant with low loss.

Benefits

• Wide range of dielectric constants (Dks)
• Excellent mechanical properties, resists creep and cold flow
• Exceptionally low thermal coefficient of Dk
• Coefficient of thermal expansion matched to copper allowing for high reliability of plated through-holes
• Available copper clad in larger formats, allowing the use of standard PCB subtractive processes
• Resistant to process chemicals, no damage to material during fabrication and assembly processes
• Thermoset resin for reliable wire bonding
• No specialized production techniques required
• TMM 10 and 10i laminates can replace alumina substrates
• RoHS compliant, environment friendly
• Third party metallization available

Applications

View current applications of this product line.

Antenna Systems

Communications
Systems

• Antenna Systems
• Communications
  Systems