TMM 10 thermoset microwave materials offer the benefits of both PTFE and ceramic based substrates, but is not limited by the same mechanical properties and production techniques.
Please see below for a sampling of data for this material formulation. For detailed material information and to use advanced features such as filtering, visit the Laminate Properties Tool.
| TMM® 10 | TMM® 10i | TMM® 13i | TMM® 3 | TMM® 4 | TMM® 6 | |
|---|---|---|---|---|---|---|
| Dielectric Constant, @10GHZ (2.5 GHz) Typical (Process) | 9.20 +/- 0.23 | 9.80+/-0.245 | 12.85+/-0.35(14) | 3.27 +/- 0.032 | 4.50+/-0.045 | 6.00+/-0.08 |
| Dielectric Constant, @10GHZ (2.5 GHz) Typical (Design) | 9.8 | 9.9 | 12.2 | 3.45 | 4.7 | 6.3 |
| Dissipation Factor TAN @10 GHz (2.5 GHz) (Typical) | 0.0022 | 0.0020 | 0.0019 | 0.0020 | 0.0020 | 0.0023 |
| Thermal Coefficient εr -50°C to 150°C ppm/°C (Typical) | -38 | -43 | -70 | 37 | 15 | -11 |
| Volume Resistivity Mohm (Typical) | 2x108 | 2x108 | TBD | 3x109 | 6x108* | 1x108* |
| Surface Resistivity Mohm (Typical) | 4x107 | 4x107 | TBD | 9x109 | 1x109* | 1x109 |
| Water Absorption D48/50% (Typical) | 0.09(10) | 0.16(10) | 0.13 | 0.06(10) | 0.07(10) | 0.06(10) |
| Thermal Conductivity W/m/°K (Typical) 50°C ASTM D5470 | 0.76 | 0.76 | 0.7617 | 0.70 | 0.70 | 0.72 |
| Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) X | 21 | 19 | 19 | 15 | 16 | 18 |
| Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) Y | 21 | 19 | 19 | 15 | 16 | 18 |
| Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) Z | 20 | 20 | 20 | 23 | 21 | 26 |
| Peel Strength 1 oz (35um) ED Foil lbs/in. (N/mm) (Typical) | 5 (0.9) | 5 (0.9) | 4 (0.7) | 5.7 (1.0) | 5.7 (1.0) | 5.7 (1.0) |
| Density gm/cm3 (Typical) | 2.8 | 2.8 | 3.0 | 1.8 | 2.1 | 2.4 |
| Flammability Rating UL94 | NON FR | NON FR | NON FR | NON FR | NON FR | NON FR |
| Lead-Free Process Compatible | Y | Y | Y | Y | Y | Y |
| PIM dBc Typical |
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