MAGTREX 555 materials are constructed from a proprietary, low loss, high resistivity ceramic filler and a high temperature thermoplastic matrix. This yields a system which is conformable, through hole via capable, and mechanically and electrically stable. These laminates feature a closely matched X/Y axis permeability and permittivity of 6 and 6.5, respectively, along with low magnetic and dielectric loss below 500 MHz. MAGTREX 555 high impedance laminates feature a low X, Y, Z CTE closely matched to copper for thermal reliability and are available in thicknesses from 40 to 260 mils. They are offered with or without copper cladding.
Please see below for a sampling of data for this material formulation. For detailed material information and to use advanced features such as filtering, visit the Laminate Properties Tool.
| MAGTREX® 555 | |
|---|---|
| Dielectric Constant, @10GHZ (2.5 GHz) Typical (Process) | εΓ = 6.5±0.5 μΓ = 6.0±0.2 |
| Dielectric Constant, @10GHZ (2.5 GHz) Typical (Design) | |
| Dissipation Factor TAN @10 GHz (2.5 GHz) (Typical) | See Data Sheet |
| Thermal Coefficient εr -50°C to 150°C ppm/°C (Typical) | ~+1000 |
| Volume Resistivity Mohm (Typical) | 6.15x108 |
| Surface Resistivity Mohm (Typical) | 1.74x108 |
| Water Absorption D48/50% (Typical) | 0.25 |
| Thermal Conductivity W/m/°K (Typical) 50°C ASTM D5470 | 0.47 |
| Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) X | 22 |
| Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) Y | 25 |
| Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) Z | 25 |
| Peel Strength 1 oz (35um) ED Foil lbs/in. (N/mm) (Typical) | 3.1 |
| Density gm/cm3 (Typical) | 3.45 |
| Flammability Rating UL94 | N/A |
| Lead-Free Process Compatible | Y |
| PIM dBc Typical |
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