SpeedWave 300P Prepreg

SpeedWave 300P prepreg is offered with multiple spread and open weave glass style and resin content combinations to maximize stackup options. This material exhibits excellent fill and flow capability around heavy copper features, a low z-axis expansion for plated through hole reliability and is CAF resistant. SpeedWave 300P prepreg is also compatible with FR-4 fabrication processes and lead-free PCB assembly processing.

Features

Low dielectric constant (Dk) of 3.0 – 3.3 at 10 GHz
Low dissipation factor (Df) of 0.0019 – 0.0022 at 10 GHz
Incorporates low Dk glass reinforcement with a range of spread and open weave offerings
Excellent fill and flow around heavy copper features
CAF resistant
UL 94-V-0

Benefits

Compatible with a variety of Rogers’ high frequency and high speed laminates
Ideal for high layer count designs
Low z-axis expansion for plated through-hole reliability
Capable of multiple sequential laminations
Compatible with FR-4 fabrication processes and lead-free PCB assembly processing

Downloads

Description	Language	File Size
Data Sheet
SpeedWave® 300P Data Sheet	English	139KB
SpeedWave 300P 半固化片数据资料表	中文	636KB
Fabrication Information
SpeedWave 300P Prepreg Fabrication Guidelines	English	355KB
SpeedWave 300P 半固化片加工指南	中文	399KB
(M)SDS/PSIS
SpeedWave 300P Prepreg - SDS	English	138KB
SpeedWave 300P Prepreg - SDS	中文	684KB