TMM 13i microwave material has an isotropic dielectric constant (Dk). Like the other TMM® series materials, TMM 13i combines many of the desirable features of ceramic and PTFE substrates, with the ease of soft substrate processing techniques.

Features

  • Dielectric Constant Dk of 12.85 +/- .35
  • Dissipation factor of .0019 at 10GHz
  • Thermal coefficient of Dk of -70 ppm/°K
  • Coefficient of thermal expansion matched to copper
  • Available in a thickness range of .0015 to .500 inches +/- .0015”

Benefits

  • Mechanical properties resist creep and cold flow
  • Resistant to process chemicals, reducing damage during fabrication
  • Material does not require a sodium napthanate treatment prior to electroless plating
  • Based on a thermoset resin, allowing for reliable wire-bonding

Properties

Please see below for a sampling of data for this material formulation. For detailed material information and to use advanced features such as filtering, visit the Laminate Properties Tool.

TMM® 10 TMM® 10i TMM® 13i TMM® 3 TMM® 4 TMM® 6
Dielectric Constant, @10GHZ (2.5 GHz) Typical (Process) 9.20 +/- 0.23 9.80+/-0.245 12.85+/-0.35(14) 3.27 +/- 0.032 4.50+/-0.045 6.00+/-0.08
Dielectric Constant, @10GHZ (2.5 GHz) Typical (Design) 9.8 9.9 12.2 3.45 4.7 6.3
Dissipation Factor TAN @10 GHz (2.5 GHz) (Typical) 0.0022 0.0020 0.0019 0.0020 0.0020 0.0023
Thermal Coefficient εr -50°C to 150°C ppm/°C (Typical) -38 -43 -70 37 15 -11
Volume Resistivity Mohm (Typical) 2x108 2x108 TBD 3x109 6x108* 1x108*
Surface Resistivity Mohm (Typical) 4x107 4x107 TBD 9x109 1x109* 1x109
Water Absorption D48/50% (Typical) 0.09(10) 0.16(10) 0.13 0.06(10) 0.07(10) 0.06(10)
Thermal Conductivity W/m/°K (Typical) 50°C ASTM D5470 0.76 0.76 0.7617 0.70 0.70 0.72
Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) X 21 19 19 15 16 18
Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) Y 21 19 19 15 16 18
Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) Z 20 20 20 23 21 26
Peel Strength 1 oz (35um) ED Foil lbs/in. (N/mm) (Typical) 5 (0.9) 5 (0.9) 4 (0.7) 5.7 (1.0) 5.7 (1.0) 5.7 (1.0)
Density gm/cm3 (Typical) 2.8 2.8 3.0 1.8 2.1 2.4
Flammability Rating UL94 NON FR NON FR NON FR NON FR NON FR NON FR
Lead-Free Process Compatible Y Y Y Y Y Y
PIM dBc Typical

Downloads

Description Language File Type File Size
Data Sheet
TMM® Thermoset Laminate Data Sheet TMM® 3 - TMM® 4 - TMM® 6 - TMM® 10 - TMM® 10i - TMM® 13i English
203KB
TMM®热固型微波材料数据资料表 中文
980KB
Fabrication Information
Fabrication Guidelines TMM High Frequency Laminates - Drilling Guidelines English
98KB
Fabrication Guidelines TMM High Frequency Laminates - Routing Guidelines English
181KB
TMM Laminate Quick Reference Processing Guide English
45KB
Electrical Design Data
Temperature Rise Estimations in Rogers High Frequency Circuit Boards Carrying Direct or RF Current English
80KB
Properties - Detailed Characteristics
Copper Foils for High Frequency Circuit Materials English
908KB
Low Outgassing Characteristics of Rogers Laminates Approved for Spacecraft Applications English
84KB
高频电路材料之铜箔概述 中文
894KB
(M)SDS/PSIS
TMM Series Laminates - PSIS English
171KB
TMM Series Laminates - PSIS 中文
382KB
TMM Series Laminates - SDS Française
179KB
TMM Series Laminates - SDS Español
172KB

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