TMM 3 laminates combine many of the benefits of both ceramic and traditional PTFE microwave circuit laminates without requiring the specialized production techniques common to those materials. TMM laminates are based on thermoset resins, making them reliable for wire-bonding without pad lifting or substrate deformation.
Please see below for a sampling of data for this material formulation. For detailed material information and to use advanced features such as filtering, visit the Laminate Properties Tool.
| TMM® 10 | TMM® 10i | TMM® 13i | TMM® 3 | TMM® 4 | TMM® 6 | |
|---|---|---|---|---|---|---|
| Dielectric Constant, @10GHZ (2.5 GHz) Typical (Process) | 9.20 +/- 0.23 | 9.80+/-0.245 | 12.85+/-0.35(14) | 3.27 +/- 0.032 | 4.50+/-0.045 | 6.00+/-0.08 |
| Dielectric Constant, @10GHZ (2.5 GHz) Typical (Design) | 9.8 | 9.9 | 12.2 | 3.45 | 4.7 | 6.3 |
| Dissipation Factor TAN @10 GHz (2.5 GHz) (Typical) | 0.0022 | 0.0020 | 0.0019 | 0.0020 | 0.0020 | 0.0023 |
| Thermal Coefficient εr -50°C to 150°C ppm/°C (Typical) | -38 | -43 | -70 | 37 | 15 | -11 |
| Volume Resistivity Mohm (Typical) | 2x108 | 2x108 | TBD | 3x109 | 6x108* | 1x108* |
| Surface Resistivity Mohm (Typical) | 4x107 | 4x107 | TBD | 9x109 | 1x109* | 1x109 |
| Water Absorption D48/50% (Typical) | 0.09(10) | 0.16(10) | 0.13 | 0.06(10) | 0.07(10) | 0.06(10) |
| Thermal Conductivity W/m/°K (Typical) 50°C ASTM D5470 | 0.76 | 0.76 | 0.7617 | 0.70 | 0.70 | 0.72 |
| Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) X | 21 | 19 | 19 | 15 | 16 | 18 |
| Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) Y | 21 | 19 | 19 | 15 | 16 | 18 |
| Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) Z | 20 | 20 | 20 | 23 | 21 | 26 |
| Peel Strength 1 oz (35um) ED Foil lbs/in. (N/mm) (Typical) | 5 (0.9) | 5 (0.9) | 4 (0.7) | 5.7 (1.0) | 5.7 (1.0) | 5.7 (1.0) |
| Density gm/cm3 (Typical) | 2.8 | 2.8 | 3.0 | 1.8 | 2.1 | 2.4 |
| Flammability Rating UL94 | NON FR | NON FR | NON FR | NON FR | NON FR | NON FR |
| Lead-Free Process Compatible | Y | Y | Y | Y | Y | Y |
| PIM dBc Typical |
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