Rogers curamik CoolPower and curamik CoolPower Plus offer superior, efficient cooling for high-performance electronic applications.
Our curamik CoolPower and curamik CoolPower Plus are high performance copper coolers for high power electronics. These can be used in high-performance electronics, high brightness LED and solar-cell arrays.
curamik CoolPower Features
Several layers of pure copper create three-dimensional structures for cooling
Hermetically sealed during curamik bonding process
curamik CoolPower Plus Features - Including the curamik CoolPower Features listed above
Integrated Direct Bond Copper (DBC) coolers with Al2O3 or AlN ceramic substrates
curamik CoolPower Benefits
curamik bonding process avoids the need for any additional soldering or adhesive layers that negatively impact thermal resistance
More efficient cooling than traditional module structures with liquid cooling
curamik CoolPower Plus Benefits – Including the curamik CoolPower Benefits listed above
DBC substrate-layers enable direct assembly (chip on board)
DBC substrate-layers provide electrical insulation from cooling circuit
