Bonding Materials Minimize Loss in Multilayer Millimeter-Wave PCBs

Published by John Coonrod, Technical Marketing Manager on May 07, 2021
Advanced Electronics Solutions

As millimeter-wave technologies continue to advance in the printed circuit board (PCB) industry, there are emerging needs for more diverse circuit constructions. A previous limiting factor for complex millimeter-wave PCB constructions, had been appropriate bonding materials to accommodate the circuit fabrication as well as the demanding RF performance at these high frequencies. These issues have been addressed in the following blog.

Read the Full Article at Microwave Journal

Related Products:
2929 Bondply, RO4000 Series Laminates, SpeedWave 300P Prepreg

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Automotive and EV HEV, ROG Blog

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