ARLON® Thermal Interface Materials

ARLON thermal interface materials are the product of over 60 years of silicone manufacturing knowledge and includes Protect® silicone thermal transfer insulator pads, Secure® adhesive films and Thermabond® electronic adhesives. These materials provide a specific set of thermal, physical and electrical properties and are designed for long-term reliability and high performance.

Protect

Protect insulators are cured silicone rubber sheets designed for insulation in LED and power applications. Protect insulators are available in two constructions:

• Protect® 1500FG: Fiber Glass Reinforced
• Protect® 1500KT2 Polyimide Reinforced

Features

• UL listed, Flame rating of UL94 V-0
• Relative thermal index (RTI) of 150°C for both mechanical and electrical
• RoHS compliant and free of halogen flame retardants

Benefits

• Offer long-term reliability
• Resist heat, humidity, and shock
• Conform to surface topography to maximize contact area at low fastener pressures
• Provide even heat transfer, which reduces hot spots
• Isolate LED PCB or power transistor from heat sink

Secure

Secure adhesive films are silicone polymer composites developed to bond directly to substrates in LED and power applications. Available in three constructions:

• Secure® 1500FG fiberglass reinforced adhesive film
• Secure® 1500KT2 polyimide (25 micron) reinforced adhesive film
• Secure® 1500U unreinforced adhesive film

Features

• Forms chemical bonds with the substrate during curing cycle
• UL listed (EL54153)
• Flame rating of UL94 V-0
• Relative thermal index (RTI) of 150°C
• RoHS compliant and free of halogen flame retardants

Benefits

• Offers long-term reliability under extreme environmental conditions
• Boasts robust adhesion that is resistant to heat, humidity and shock
• Direct bond eliminates need for mechanical fasteners and related problems
• Isolates the electrical component from heat sink

Thermabond

Thermabond electronic adhesives are composed of elastomeric materials that provide thermal-mechanical stress decoupling and heat transfer within printed circuit boards used primarily in aerospace applications. Thermabond is available in a wide range of products.

Features

• Thermal conductivity up to 3W/mK to transport heat away from hot spots
• Low modulus and high shear strength prevent adhesive delamination
• Cure parameters as low as 100°C at 100 kPa

Benefits

• Successfully bonds to a broad variety of surfaces
• Prevents stress buildup created by CTE mismatch by allowing adjoining components to move freely
• Performs in demanding environments under exposure to extreme temperatures and vibration
• Fully tested and certified for space flight applications