ARLON® Thermal Interface Materials

ARLON thermal interface materials are the product of over 60 years of silicone manufacturing knowledge and includes Protect® silicone thermal transfer insulator pads, Secure® adhesive films and Thermabond® electronic adhesives. These materials deliver a specific set of thermal, physical and electrical properties and are designed for long-term reliability and high performance.

Protect insulators are cured silicone rubber sheets designed for insulation in LED and power applications. Protect insulators are available in two constructions:

• Protect® 1500FG
• Protect® 1500KT2

Features

• UL listed, Flame rating of UL94 V-0
• Relative thermal index (RTI) of 150°C for both mechanical and electrical
• RoHS compliant and free of halogen flame retardants

Benefits

• Offer long-term reliability
• Resist heat, humidity and shock
• Conform to surface topography to maximize contact area at low fastener pressures
• Provide even heat transfer, which reduces hot spots
• Isolates LED PCB or power transistor from heat sink

Secure adhesive films are silicone polymer composites developed to bond directly to substrates in LED and power applications. Available in 4 constructions:

• Secure® 1500FG fiberglass reinforced adhesive film
• Secure® 1500KT2 polyimide (25 micron) reinforced adhesive film
• Secure® 1500U unreinforced adhesive film
• Secure® 1600XF fiberglass reinforced hybrid adhesive film

Features

• Forms chemical bonds with the substrate during curing cycle
• UL listed (EL54153)
• Flame rating of UL94 V-0
• Relative thermal index (RTI) of 150°C
• RoHS compliant and free of halogen flame retardants

Benefits

• Offers long-term reliability under extreme environmental conditions
• Boasts robust adhesion that is resistant to heat, humidity and shock
• Direct bond eliminates need for mechanical fasteners and related problems
• Isolates the electrical component from heat sink

Thermabond electronic adhesives are composed of elastomeric materials that provide thermal-mechanical stress decoupling and heat transfer within printed circuit boards used in aerospace and automotive applications. Thermabond is available in a wide range of products.

Features

• Thermal conductivity up to 3W/mK to transport heat away from hot spots
• Low modulus and high shear strength prevent adhesive delamination
• Cure parameters as low as 100°C at 100 kPa

Benefits

• Successfully bonds to a broad variety of surfaces
• Prevents stress build-up created by CTE mismatch by allowing adjoining components to move freely
• Performs in demanding environments under exposure to extreme temperatures and vibration
• Fully tested and certified for space flight applications