Release Date: 02/27/2025

Chandler, Arizona, February 27, 2025: Rogers Corporation (NYSE:ROG) announced its latest innovation in dielectric materials: RO4830™ Plus Circuit Materials, which are well suited for cost-sensitive millimeter wave PCB applications, such as 76-81 GHz automotive corner radar sensors.

Electrical performance optimized for 76-81 GHz automotive radar applications

RO4830 Plus woven glass free, thermoset laminates possess the stable dielectric constant and low insertion loss required by RF designers for millimeter wave automotive radar sensors. The design dielectric constant of RO4830 Plus laminates is approximately 3.03 at 77GHz (microstrip differential phase length method). The combination of Rogers’ new low-loss thermoset resin and very low profile electrodeposited copper foil translates to a very low insertion loss of 1.5 dB/inch for 5mil laminates, as measured by the microstrip differential phase length method.

PCB fabrication characteristics reduce overall PCB manufacturing costs

RO4830 Plus laminates are engineered for the cap layer on FR-4 multi-layer board designs, which are commonly used for 76- 81 GHz automotive radar sensor PCB applications. These thermoset laminates are free of woven glass, contributing to good laser drilling performance, and CAF resistance. RO4830 Plus laminates can be fabricated using standard epoxy/glass (FR-4) processes and are compatible with RO4400™ bond ply. These PFAS-free laminates have the UL-V0 flame retardant rating and are lead free solder process compatible.

RO4830 Plus laminates provide:

  1. Stable dielectric constant and low insertion loss at 77GHz via Rogers’ new thermoset resin system combined with a very low profile electrodeposited copper (VLP ED).
  2. New woven-glass-free thermoset material maximizes fabrication yield and efficiency, further reducing the overall cost of PCBs.

Available in dielectric thicknesses of 0.005, Rogers RO4830 Plus laminates are available in standard panel sizes of 24×18 in. (610×457 mm), 24×20 in. (610×508 mm), 24×21in. (610×533 mm) with 0.5 oz. (18 µm) VLP ED.

About Rogers Corporation

Rogers Corporation (NYSE:ROG) is a global technology leader in specialty materials and components for consumer electronics, power electronics, mass transit, clean technology, and telecommunications infrastructure. With more than 180 years of materials science and engineering experience, Rogers provides product designers with solutions to help them power, protect and connect our world with greater reliability, efficiency and performance. Rogers’ three core businesses include Power Electronics Solutions for high-voltage rail traction, energy efficient power drives, wind and solar power conversion; High Performance Foams for cushioning, sealing and impact protection in tablets and smart phones, aircraft, rail and automotive interiors, sporting goods, apparel and gear; and Printed Circuit Materials for wireless infrastructure, power amplifiers, smart antennas, and radar systems for automotive and defense applications. Headquartered in Connecticut (USA), Rogers operates manufacturing facilities in the United States, China, Germany, Belgium, and South Korea, and sales offices worldwide. For more information, visit www.rogerscorp.com.

Media Contact

Amy Kweder
Senior Director, Corporate Communications
Phone: 480.203.0058
Email: amy.kweder@rogerscorporation.com

Return to News