Advanced materials with high reliability under extreme conditions, critical for aerospace, commercial aircraft and defense applications.
For decades, design engineers have relied on Rogers’ advanced materials to enable commercial aircraft and aerospace and defense systems, even in the harshest conditions. Today, our high reliability, high performance solutions can be found in the majority of the world’s commercial and military aircraft. Look to Rogers for high frequency circuit materials for radar and navigation systems, ceramic substrates and laminated busbars that improve performance and dissipate heat, and gasketing solutions for extreme sealing and protection.
Applications
View current applications of Rogers' products, relating to the Aerospace & Defense market.
Rogers Corporation’s CLTE Series® products are PTFE, woven-glass, microdispersed ceramic composite laminates with low CTE values ideal for high reliability.
COOLSPAN® Thermally and Electrically Conductive Adhesive (TECA) is a thermosetting, epoxy based, silver filled adhesive film used in bonding high power circuit boards.
Rogers Corporation’s CuClad® laminates are woven fiberglass reinforced PTFE based composites for use as PCB substrates and radomes in high frequency applications.
Rogers Corporation’s curamik® product suite offers best-in-class metallized ceramic substrates that lead the industry in enabling power electronic printed circuits.
Rogers Corporation’s DiClad® laminates are fiberglass reinforced PTFE based composites for use as printed circuit board substrates in high frequency applications.
RT/duroid® high frequency circuit materials are filled PTFE (random glass or ceramic) composite laminates for use in high reliability, aerospace and defense applications.
Rogers Corporation’s TC Series® laminates are PTFE, woven fiberglass and high thermal conductivity ceramic filled materials that provide improved PBC thermal management for applications requiring high power RF signals.
