RO3006 advanced circuit materials provide a stable dielectric constant (Dk) over a range of temperatures. This stability eliminates the step change in Dk that occurs for PTFE glass materials near room temperature.
Please see below for a sampling of data for this material formulation. For detailed material information and to use advanced features such as filtering, visit the Laminate Properties Tool.
| RO3003™ | RO3006™ | RO3010™ | RO3035™ | |
|---|---|---|---|---|
| Dielectric Constant, @10GHZ (2.5 GHz) Typical (Process) | 3.00+/-0.047 | 6.15+/-0.15 | 10.20+/-0.30 | 3.50+/-0.05 |
| Dielectric Constant, @10GHZ (2.5 GHz) Typical (Design) | 3.1629 | 6.4 | 11.2 | 3.60 |
| Dissipation Factor TAN @10 GHz (2.5 GHz) (Typical) | 0.0010 | 0.002 | 0.0022 | 0.0015 |
| Thermal Coefficient εr -50°C to 150°C ppm/°C (Typical) | -3 | -262 | -395 | -45 |
| Volume Resistivity Mohm (Typical) | 1x107 | 1x105 | 1x105 | 1x107 |
| Surface Resistivity Mohm (Typical) | 1x107 | 1x105 | 1x105 | 1x107 |
| Water Absorption D48/50% (Typical) | 0.04 | 0.02 | 0.05 | 0.04 |
| Thermal Conductivity W/m/°K (Typical) 50°C ASTM D5470 | 0.50 | 0.79 | 0.95 | 0.50 |
| Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) X | 17 | 17 | 13 | 17 |
| Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) Y | 16 | 17 | 11 | 17 |
| Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) Z | 25 | 24 | 16 | 24 |
| Peel Strength 1 oz (35um) ED Foil lbs/in. (N/mm) (Typical) | 12.7 (2.2) | 7.1 (1.2) | 9.4 (1.6) | 10.2 (1.8) |
| Density gm/cm3 (Typical) | 2.1 | 2.6 | 2.8 | 2.1 |
| Flammability Rating UL94 | V-0 | V-0 | V-0 | V-0 |
| Lead-Free Process Compatible | Y | Y | Y | Y |
| PIM dBc Typical |
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