RO3010 laminates are competitively priced products with exceptional mechanical and electrical stability. This stability simplifies the design of broadband components and allows the materials to be used in a wide range of applications over a very broad range of frequencies. This material’s characteristics make RO3010 laminates excellent for circuit miniaturization.

Features

  • Dk of 10.2 +/- .30
  • Dissipation factor of .0022 at 10 GHz
  • Low X, Y and Z axis CTE of 13, 11 and 16 ppm/°C, respectively

Benefits

  • Material exhibits dimensional stability with expansion coefficient matched to copper
  • ISO 9001 Certified
  • Suitable for use with multi-layer board designs

Please see below for a sampling of data for this material formulation. For detailed material information and to use advanced features such as filtering, visit the Laminate Properties Tool.

RO3003™ RO3006™ RO3010™ RO3035™
Dielectric Constant, @10GHZ (2.5 GHz) Typical (Process) 3.00+/-0.047 6.15+/-0.15 10.20+/-0.30 3.50+/-0.05
Dielectric Constant, @10GHZ (2.5 GHz) Typical (Design) 3.1629 6.4 11.2 3.60
Dissipation Factor TAN @10 GHz (2.5 GHz) (Typical) 0.0010 0.002 0.0022 0.0015
Thermal Coefficient εr -50°C to 150°C ppm/°C (Typical) -3 -262 -395 -45
Volume Resistivity Mohm (Typical) 1x107 1x105 1x105 1x107
Surface Resistivity Mohm (Typical) 1x107 1x105 1x105 1x107
Water Absorption D48/50% (Typical) 0.04 0.02 0.05 0.04
Thermal Conductivity W/m/°K (Typical) 50°C ASTM D5470 0.50 0.79 0.95 0.50
Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) X 17 17 13 17
Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) Y 16 17 11 17
Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) Z 25 24 16 24
Peel Strength 1 oz (35um) ED Foil lbs/in. (N/mm) (Typical) 12.7 (2.2) 7.1 (1.2) 9.4 (1.6) 10.2 (1.8)
Density gm/cm3 (Typical) 2.1 2.6 2.8 2.1
Flammability Rating UL94 V-0 V-0 V-0 V-0
Lead-Free Process Compatible Y Y Y Y
PIM dBc Typical

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