RO4360G2 laminates are the first high dielectric constant (Dk) thermoset laminate that can be processed similar to FR-4. These materials are lead-free process capable and offer better rigidity for improved processability in multi-layer board constructions, while reducing material and fabrication costs. RO4360G2 laminates can be paired with RO4400™ series prepreg and lower-Dk RO4000® laminate in multi-layer designs.
Please see below for a sampling of data for this material formulation. For detailed material information and to use advanced features such as filtering, visit the Laminate Properties Tool.
| RO4360G2™ | |
|---|---|
| Dielectric Constant, @10GHZ (2.5 GHz) Typical (Process) | 6.15 +/- 0.15 |
| Dielectric Constant, @10GHZ (2.5 GHz) Typical (Design) | 6.4 |
| Dissipation Factor TAN @10 GHz (2.5 GHz) (Typical) | 0.0038 |
| Thermal Coefficient εr -50°C to 150°C ppm/°C (Typical) | -131 |
| Volume Resistivity Mohm (Typical) | 4x107 |
| Surface Resistivity Mohm (Typical) | 9x106 |
| Water Absorption D48/50% (Typical) | 0.08 |
| Thermal Conductivity W/m/°K (Typical) 50°C ASTM D5470 | 0.75 |
| Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) X | 13 |
| Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) Y | 14 |
| Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) Z | 28 |
| Peel Strength 1 oz (35um) ED Foil lbs/in. (N/mm) (Typical) | 5.2 (0.91) |
| Density gm/cm3 (Typical) | 2.16 |
| Flammability Rating UL94 | V-0 |
| Lead-Free Process Compatible | Y |
| PIM dBc Typical |
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