RT/duroid 5870 laminates offer high frequency with low dielectric constant (Dk). The randomly oriented microfibers in the PTFE composites result in exceptional Dk uniformity. With its low Dk loss, RT/duroid 5870 laminates are well suited for high frequency/broadband applications where dispersion and losses need to be minimized.
Please see below for a sampling of data for this material formulation. For detailed material information and to use advanced features such as filtering, visit the Laminate Properties Tool.
RT/duroid® 5870 | RT/duroid® 5880 | |
---|---|---|
Dielectric Constant, @10GHZ (2.5 GHz) Typical (Process) | 2.33 +/- 0.02 | 2.20 +/- 0.02 |
Dielectric Constant, @10GHZ (2.5 GHz) Typical (Design) | 2.33 | 2.20 |
Dissipation Factor TAN @10 GHz (2.5 GHz) (Typical) | 0.0012 | 0.0009 |
Thermal Coefficient εr -50°C to 150°C ppm/°C (Typical) | -115 | -125 |
Volume Resistivity Mohm (Typical) | 2x107 | 2x107 |
Surface Resistivity Mohm (Typical) | 2x107 | 3x107 |
Water Absorption D48/50% (Typical) | 0.02 | 0.02 |
Thermal Conductivity W/m/°K (Typical) 50°C ASTM D5470 | 0.22 | 0.20 |
Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) X | 22 | 31 |
Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) Y | 28 | 48 |
Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) Z | 173 | 237 |
Peel Strength 1 oz (35um) ED Foil lbs/in. (N/mm) (Typical) | 27.2 (4.8) | 31.2 (5.5) |
Density gm/cm3 (Typical) | 2.2 | 2.2 |
Flammability Rating UL94 | V-0 | V-0 |
Lead-Free Process Compatible | Y | Y |
PIM dBc Typical |
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