RT/duroid 5880LZ laminates contain a unique filler that results in a low density, lightweight material for high performance and weight sensitive applications.


  • Dk of 2.00 +/- .04
  • Low dissipation factor ranging from .0021 to .0027 at 10GHz
  • Low Z-axis coefficient of thermal expansion at 40 ppm/°C
  • Low density of 1.4 gm/cm3


  • Lightweight / low density
  • Uniform electrical properties over a wide frequency range
  • Resistant to all solvents and reagents, hot or cold, normally used in etching or plating



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