RT/duroid 5880LZ laminates contain a unique filler that results in a low density, lightweight material for high performance and weight sensitive applications.
Please see below for a sampling of data for this material formulation. For detailed material information and to use advanced features such as filtering, visit the Laminate Properties Tool.
| RT/duroid® 5880LZ | |
|---|---|
| Dielectric Constant, @10GHZ (2.5 GHz) Typical (Process) | 2.00 +/- 0.04 |
| Dielectric Constant, @10GHZ (2.5 GHz) Typical (Design) | 2.0 |
| Dissipation Factor TAN @10 GHz (2.5 GHz) (Typical) | 0.0021 |
| Thermal Coefficient εr -50°C to 150°C ppm/°C (Typical) | 20 |
| Volume Resistivity Mohm (Typical) | 1.74x107 |
| Surface Resistivity Mohm (Typical) | 2.08x106 |
| Water Absorption D48/50% (Typical) | 0.31 |
| Thermal Conductivity W/m/°K (Typical) 50°C ASTM D5470 | 0.33 |
| Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) X | 54 |
| Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) Y | 47 |
| Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) Z | 40 |
| Peel Strength 1 oz (35um) ED Foil lbs/in. (N/mm) (Typical) | >4.0 |
| Density gm/cm3 (Typical) | 1.4 |
| Flammability Rating UL94 | V-0 |
| Lead-Free Process Compatible | Y |
| PIM dBc Typical |
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