RT/duroid 6035HTC laminates are an exceptional choice for high power applications. The laminates have a thermal conductivity of almost 2.4 times the standard RT/duroid 6000 products, and copper foil (ED and reverse treat) with excellent long term thermal stability. Additionally, Rogers advanced filler system enables excellent drill-ability, reducing drilling costs as compared to standard high thermally conductive laminates that use alumina fillers.
Please see below for a sampling of data for this material formulation. For detailed material information and to use advanced features such as filtering, visit the Laminate Properties Tool.
| RT/duroid® 6035HTC | |
|---|---|
| Dielectric Constant, @10GHZ (2.5 GHz) Typical (Process) | 3.50+/-0.05 |
| Dielectric Constant, @10GHZ (2.5 GHz) Typical (Design) | 3.60 |
| Dissipation Factor TAN @10 GHz (2.5 GHz) (Typical) | 0.0013 |
| Thermal Coefficient εr -50°C to 150°C ppm/°C (Typical) | -66 |
| Volume Resistivity Mohm (Typical) | 1x108 |
| Surface Resistivity Mohm (Typical) | 1x108 |
| Water Absorption D48/50% (Typical) | 0.0612 |
| Thermal Conductivity W/m/°K (Typical) 50°C ASTM D5470 | 1.44 |
| Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) X | 19 |
| Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) Y | 19 |
| Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) Z | 39 |
| Peel Strength 1 oz (35um) ED Foil lbs/in. (N/mm) (Typical) | 7.9 (1.4) |
| Density gm/cm3 (Typical) | 2.2 |
| Flammability Rating UL94 | V-0 |
| Lead-Free Process Compatible | Y |
| PIM dBc Typical |
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