RT/duroid 6202 high frequency laminates offer electrical and mechanical properties essential in designing complex microwave structures that are mechanically reliable and electrically stable. Excellent dimensional stability (0.05 to 0.07 mils/inch) is achieved by the addition of limited woven glass reinforcement. This often eliminates double etching to achieve tight positional tolerances.
Please see below for a sampling of data for this material formulation. For detailed material information and to use advanced features such as filtering, visit the Laminate Properties Tool.
| RT/duroid® 6202 | |
|---|---|
| Dielectric Constant, @10GHZ (2.5 GHz) Typical (Process) | 2.94+/-0.048 |
| Dielectric Constant, @10GHZ (2.5 GHz) Typical (Design) | 2.94+/-0.048 |
| Dissipation Factor TAN @10 GHz (2.5 GHz) (Typical) | 0.0015 |
| Thermal Coefficient εr -50°C to 150°C ppm/°C (Typical) | +5 to -158 |
| Volume Resistivity Mohm (Typical) | 1x106 |
| Surface Resistivity Mohm (Typical) | 1x109 |
| Water Absorption D48/50% (Typical) | 0.04 |
| Thermal Conductivity W/m/°K (Typical) 50°C ASTM D5470 | 0.68 |
| Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) X | 15 |
| Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) Y | 15 |
| Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) Z | 30 |
| Peel Strength 1 oz (35um) ED Foil lbs/in. (N/mm) (Typical) | 9.1 (1.6) |
| Density gm/cm3 (Typical) | 2.1 |
| Flammability Rating UL94 | V-0 |
| Lead-Free Process Compatible | Y |
| PIM dBc Typical |
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