TC350 Plus materials offer the designer a unique combination of lower loss tangent (and insertion loss) and high thermally conductive fillers to enable superior reliability and reduced operating temperatures in high power applications.
Please see below for a sampling of data for this material formulation. For detailed material information and to use advanced features such as filtering, visit the Laminate Properties Tool.
| TC350™ Plus | |
|---|---|
| Dielectric Constant, @10GHZ (2.5 GHz) Typical (Process) | 3.50+/-0.05 |
| Dielectric Constant, @10GHZ (2.5 GHz) Typical (Design) | 3.62 |
| Dissipation Factor TAN @10 GHz (2.5 GHz) (Typical) | 0.0017 |
| Thermal Coefficient εr -50°C to 150°C ppm/°C (Typical) | -42 |
| Volume Resistivity Mohm (Typical) | 9.4x1011 |
| Surface Resistivity Mohm (Typical) | 3.3x1012 |
| Water Absorption D48/50% (Typical) | 0.05(25) |
| Thermal Conductivity W/m/°K (Typical) 50°C ASTM D5470 | 1.24 |
| Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) X | 10 |
| Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) Y | 9 |
| Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) Z | 38 |
| Peel Strength 1 oz (35um) ED Foil lbs/in. (N/mm) (Typical) | 4.0 (0.7) |
| Density gm/cm3 (Typical) | TBD |
| Flammability Rating UL94 | V-0 |
| Lead-Free Process Compatible | Y |
| PIM dBc Typical |
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