Network designers face a variety of challenges in today’s complex data centers. They need high performance circuit materials with superior electrical properties for applications like IP Infrastructure, Computing, and Test and Measurement. At the same time, they must reduce power consumption, lower cooling requirements and improve costs. That’s why they turn to Rogers. Our circuit materials are engineered to meet the unique electrical and thermal/mechanical demands of your high speed designs. And our ROLINX® busbars prevent thermal and voltage fluctuations in data centers that can have countless routers, switches and servers. Rogers even solves enclosure challenges with BISCO® silicone materials that offer sealing and gasketing solutions that won’t set or relax for effective seals that withstand the test of time.

Related Products

2929 Bondply Series

Rogers 2929 bondply is an unreinforced, thermoset based, thin film adhesive system.

BISCO® Silicones

The BISCO® product line is the world leader in silicone foams used for gasketing and sealing applications.

curamik® Metallized Ceramic Substrates

Rogers Corporation’s curamik® product suite offers best-in-class metallized ceramic substrates that lead the industry in enabling power electronic printed circuits.

RO4000® Series

RO4000® hydrocarbon ceramic laminates and prepregs are the industry leader.

ROLINX® Busbars

Rogers Corporation’s ROLINX® busbars are the global industry leader. Laminated busbars are engineered components used for power distribution.

XtremeSpeed™ RO1200™ Series 

Rogers Corporation’s XtremeSpeed™ RO1200™ laminates and bondplys are low dielectric constant, low loss materials engineered to meet the unique electrical, thermal and mechanical requirements of high speed designs.

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