CLTE-MW laminates provide PCB designers a high performance, cost-effective material, well suited for applications with thickness limitations due to physical or electrical constraints. This unique laminate system is available in seven thickness options, from 3 to 10 mils, ensuring that ideal signal to ground spacing exists for 5G and other millimeter wave applications. The CLTE-MW laminates are reinforced with spread glass which, along with a high filler loading, helps minimize the high frequency glass weave effects on electromagnetic wave propagation.
Please see below for a sampling of data for this material formulation. For detailed material information and to use advanced features such as filtering, visit the Laminate Properties Tool.
| CLTE-MW™ | |
|---|---|
| Dielectric Constant, @10GHZ (2.5 GHz) Typical (Process) | 2.94-3.02+/-0.04 |
| Dielectric Constant, @10GHZ (2.5 GHz) Typical (Design) | 3.03-3.10 |
| Dissipation Factor TAN @10 GHz (2.5 GHz) (Typical) | 0.0015 |
| Thermal Coefficient εr -50°C to 150°C ppm/°C (Typical) | -35 |
| Volume Resistivity Mohm (Typical) | 1.3x107 |
| Surface Resistivity Mohm (Typical) | 2.5x106 |
| Water Absorption D48/50% (Typical) | 0.0322 |
| Thermal Conductivity W/m/°K (Typical) 50°C ASTM D5470 | 0.42 |
| Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) X | 8 |
| Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) Y | 8 |
| Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) Z | 30 |
| Peel Strength 1 oz (35um) ED Foil lbs/in. (N/mm) (Typical) | 6.0 (1.1) |
| Density gm/cm3 (Typical) | 2.1 |
| Flammability Rating UL94 | V-0 |
| Lead-Free Process Compatible | Y |
| PIM dBc Typical |
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