CuClad 217 laminate’s cross plied construction provides in-plane electrical and mechanical isotropy. CuClad 217 uses a low fiberglass/PTFE ratio to provide the lowest dielectric constant (Dk) and dissipation factor available in fiberglass reinforced PTFE based laminates. Together, these properties offer faster signal propagation and higher signal/noise ratios.
Please see below for a sampling of data for this material formulation. For detailed material information and to use advanced features such as filtering, visit the Laminate Properties Tool.
| CuClad® 217 | CuClad® 233 | CuClad® 250 | |
|---|---|---|---|
| Dielectric Constant, @10GHZ (2.5 GHz) Typical (Process) | 2.17, 2.20+/-0.02 | 2.33+/-0.02 | 2.40-2.55+/-0.04 |
| Dielectric Constant, @10GHZ (2.5 GHz) Typical (Design) | 2.17, 2.20 | 2.40 | 2.40-2.60 |
| Dissipation Factor TAN @10 GHz (2.5 GHz) (Typical) | 0.0009 | 0.0013 | 0.0017 |
| Thermal Coefficient εr -50°C to 150°C ppm/°C (Typical) | -151 | -171 | -170 |
| Volume Resistivity Mohm (Typical) | 2.3x108 | 8.0x108 | 8.0x109 |
| Surface Resistivity Mohm (Typical) | 3.4x106 | 2.4x106 | 1.5x108 |
| Water Absorption D48/50% (Typical) | 0.0222 | 0.0222 | 0.0322 |
| Thermal Conductivity W/m/°K (Typical) 50°C ASTM D5470 | 0.26 | 0.26 | 0.25 |
| Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) X | 29 | 23 | 18 |
| Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) Y | 28 | 24 | 19 |
| Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) Z | 246 | 194 | 177 |
| Peel Strength 1 oz (35um) ED Foil lbs/in. (N/mm) (Typical) | 14.0 (2.50) | 14.0 (2.50) | 14.0 (2.50) |
| Density gm/cm3 (Typical) | 2.23 | 2.26 | 2.31 |
| Flammability Rating UL94 | V-0 | V-0 | V-0 |
| Lead-Free Process Compatible | Y | Y | Y |
| PIM dBc Typical |
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