CuClad 233 laminates use a medium fiberglass/PTFE ratio to balance the lower dielectric constant (Dk) and improved dissipation factor without sacrificing mechanical properties. The CuClad 233 laminates have a cross plied construction that provides greater dimensional stability with balanced electrical and mechanical properties.


  • Dk of 2.33
  • Dissipation factor of .0013 at 10 GHz
  • Low moisture absorption and out-gassing
  • Stable Dk over a wide frequency range


  • Low Dk supports wider line widths for lower insertion loss
  • Low circuit losses at high frequency
  • Supports large PCB and Antenna format
  • CuClad 233 CTE value in-plane matches aluminum used for aircraft skins/structures


Description Language File Type File Size
Data Sheet
CuClad® Laminates Data Sheet English
Fabrication Information
CuClad Laminates Fabrication Guide English
CuClad Series Laminates - PSIS English


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