IsoClad 917 laminates use a low ratio of non-woven fiberglass/PTFE to achieve the lowest dielectric constant and dissipation factor available in its class. The non-woven reinforcement allows these laminates to be used in applications where the final PCB may be bent in shape, including con-formal or wrap-around antennas. IsoClad’s longer random fibers and proprietary process provide greater dimensional stability and dielectric constant uniformity than competitors in similar classes.
Please see below for a sampling of data for this material formulation. For detailed material information and to use advanced features such as filtering, visit the Laminate Properties Tool.
| IsoClad® 917 | IsoClad® 933 | |
|---|---|---|
| Dielectric Constant, @10GHZ (2.5 GHz) Typical (Process) | 2.17+/-0.02 | 2.33+/-0.04 |
| Dielectric Constant, @10GHZ (2.5 GHz) Typical (Design) | 2.17 | 2.33 |
| Dissipation Factor TAN @10 GHz (2.5 GHz) (Typical) | 0.0013 | 0.0016 |
| Thermal Coefficient εr -50°C to 150°C ppm/°C (Typical) | -157 | -132 |
| Volume Resistivity Mohm (Typical) | 1.5x1010 | 3.5x108 |
| Surface Resistivity Mohm (Typical) | 1.0x109 | 1.0x108 |
| Water Absorption D48/50% (Typical) | 0.0422 | 0.0522 |
| Thermal Conductivity W/m/°K (Typical) 50°C ASTM D5470 | 0.26 | 0.26 |
| Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) X | 46 | 31 |
| Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) Y | 47 | 35 |
| Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) Z | 236 | 203 |
| Peel Strength 1 oz (35um) ED Foil lbs/in. (N/mm) (Typical) | 10.0 (1.79) | 10.0 (1.79) |
| Density gm/cm3 (Typical) | 2.23 | 2.27 |
| Flammability Rating UL94 | V-0 | V-0 |
| Lead-Free Process Compatible | Y | Y |
| PIM dBc Typical |
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