CuClad® 6250 Bonding Film

CuClad 6250 bonding film is an ethylene-acrylic acid thermoplastic co-polymer recommended for bonding dielectric structures like PTFE/glass where exposure to high temperature or high pressure is not desirable. The CuClad 6250 bonding film is available in both 24” (610mm) roll form and sheeted format.

Features

• Thickness of .0015” (.038mm)
• Dielectric constant of 2.32
• Loss tangent of .0015 at 10 GHz
• Resin melt temperature 213°F (101°C)

Benefits

• Allows for lower temperature and lower pressure lamination than conventional RF thermoplastic films
• Close match on dielectric properties with laminate systems often selected for multi-layer PCBs
• Enables attachment of pressure sensitive layers, including dielectric foams

Applications

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