With a low dielectric constant (Dk) and dissipation factor, XtremeSpeed RO1200 materials provide outstanding signal integrity, reduced signal skew and reduced cross-talk. Combined with superior thermal/mechanical performance, low CTE and a halogen free UL 94 V-0 rating, XtremeSpeed RO1200 materials are well suited for the most demanding high layer count applications.

Features

  • Low Dk
  • Max dissipation factor of .0017 (Laminate) and .0012 (Bondply) at 10GHz
  • Low CTE, Decomposition Temperature (Td) of 500°C TGA
  • Low profile rolled copper cladding on laminates
  • Spread glass reinforced laminates for improved rigidity and ease of handling
  • Unreinforced bondply enables best-in-class electrical performance
  • Halogen free

Benefits

  • Outstanding signal integrity (SI)
  • Excellent thermal/mechanical performance characteristics
  • Lead-free process compatible
  • Reduced signal skew
  • Ideal for high layer count structures

Downloads

Description Language File Type File Size
Data Sheet
XtremeSpeed™ RO1200™ Series Circuit Materials Data Sheet English
467KB
XtremeSpeed™ RO1200™ Bondply Data Sheet English
270KB
XtremeSpeed™ RO1200™ 系列电路材料数据资料表 中文
2MB
XtremeSpeed™ RO1200™ 粘结片数据资料表 中文
550KB
Fabrication Information
Fabrication Guidelines RO1200 Materials English
97KB
Quick Reference Processing Guidelines RO1200 Materials English
74KB
RO1200超低损耗高速层压板材料加工指南 中文
1MB
RO1200超低损耗高速层压板材料加工指南快速参照表 中文
423KB
(M)SDS/PSIS
RO1200 Laminate Series - PSIS English
181KB

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