RO4350B laminates provide tight control on dielectric constant (Dk) and maintain low loss while utilizing the same processing method as standard epoxy/glass. Available at a fraction of the cost of conventional microwave laminates, RO4350B laminates do not require the special through-hole treatments or handling procedures as PTFE based materials. These materials are UL 94 V-0 rated for active devices and high power RF designs.
Please see below for a sampling of data for this material formulation. For detailed material information and to use advanced features such as filtering, visit the Laminate Properties Tool.
| RO4003C™ | RO4350B™ | |
|---|---|---|
| Dielectric Constant, @10GHZ (2.5 GHz) Typical (Process) | 3.38+/-0.05 | 3.48 +/- 0.05 |
| Dielectric Constant, @10GHZ (2.5 GHz) Typical (Design) | 3.55 | 3.66 |
| Dissipation Factor TAN @10 GHz (2.5 GHz) (Typical) | 0.0027 | 0.0037 |
| Thermal Coefficient εr -50°C to 150°C ppm/°C (Typical) | 40 | 50 |
| Volume Resistivity Mohm (Typical) | 1.7x1010 | 1.2x1010 |
| Surface Resistivity Mohm (Typical) | 4.2x109 | 5.7x109 |
| Water Absorption D48/50% (Typical) | 0.04 | 0.05 |
| Thermal Conductivity W/m/°K (Typical) 50°C ASTM D5470 | 0.71 | 0.69 |
| Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) X | 11 | 10 |
| Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) Y | 14 | 12 |
| Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) Z | 46 | 32 |
| Peel Strength 1 oz (35um) ED Foil lbs/in. (N/mm) (Typical) | 6.0 (1.05) | 5.0 (0.88) |
| Density gm/cm3 (Typical) | 1.8 | 1.9 |
| Flammability Rating UL94 | NON FR | V-0 |
| Lead-Free Process Compatible | Y | Y |
| PIM dBc Typical |
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