RO4500 high frequency laminates are fully compatible with conventional FR-4 and high temperature lead free solder processing. These laminates do not require special treatment needed on traditional PTFE-based laminates for plated through-hole preparation. The resin systems of RO4500 dielectric materials provide the necessary properties for ideal antenna performance. This product series is an affordable alternative to more conventional antenna technologies, thus allowing designers to maximize the price and performance of their antennas.
Please see below for a sampling of data for this material formulation. For detailed material information and to use advanced features such as filtering, visit the Laminate Properties Tool.
| RO4533™ | RO4534™ | RO4535™ | |
|---|---|---|---|
| Dielectric Constant, @10GHZ (2.5 GHz) Typical (Process) | 3.30+/-0.08 | 3.40 +/- 0.08 | 3.44+/-0.08 |
| Dielectric Constant, @10GHZ (2.5 GHz) Typical (Design) | 3.45 | 3.55 | 3.60 |
| Dissipation Factor TAN @10 GHz (2.5 GHz) (Typical) | 0.0025 (0.0020) | 0.0027 (0.0022) | 0.0037 (0.0032) |
| Thermal Coefficient εr -50°C to 150°C ppm/°C (Typical) | 40 | 40 | 50 |
| Volume Resistivity Mohm (Typical) | 1.1x1010 | 1.7x1010 | 1.2x1010 |
| Surface Resistivity Mohm (Typical) | 9.9x108 | 4.2x109 | 5.7x109 |
| Water Absorption D48/50% (Typical) | 0.02 | 0.06 | 0.09 |
| Thermal Conductivity W/m/°K (Typical) 50°C ASTM D5470 | 0.60 | 0.60 | 0.6 |
| Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) X | 13 | 11 | 16 |
| Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) Y | 11 | 14 | 17 |
| Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) Z | 37 | 46 | 50 |
| Peel Strength 1 oz (35um) ED Foil lbs/in. (N/mm) (Typical) | 6.9 (1.2) | 6.3 (1.1) | 5.1 (0.9) |
| Density gm/cm3 (Typical) | 1.8 | 1.8 | 1.9 |
| Flammability Rating UL94 | NON FR | NON FR | V-0 |
| Lead-Free Process Compatible | Y | Y | Y |
| PIM dBc Typical | -157 | -157 | -157 |
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